Development of Multi-Layer Fabrication Process for SFQ Large Scale Integrated Digital Circuits

Nb 9-Layer Fabrication Process for Superconducting Large-Scale SFQ Circuits and Its Process Evaluation

We describe the recent progress on a Nb nine-layer fabrication process for large-scale single flux quantum (SFQ) circuits. A device fabricated in this process is composed of an active layer including Josephson junctions (JJ) at the top, passive transmission line (PTL) layers in the middle, and a DC power layer at the bottom. We describe the process conditions and the fabrication equipment. We u...

An improved multi-layer fabrication process for YBa2Cu3O7-x-based circuits

Improved via connections i n structures of YBa,Cu,07.,/SrTi0,/YBa,Cu,0,, (YBCO /STO/ YBCO) multilayers have been made using a combined HF wet-etching and ion-mil l ing process. The critical current density Jc of the via is as high as 2 x l o 6 A/cm2 at 76 K, and i s dominated by edge contacts in the ab-plane. YBCO and Sr,AlNbO, (SAN) multilayer test circuits were also made with this process. Th...

Fabrication Processes for Integrated Circuits

Fabrication Processes for Integrated Circuits

Integrated circuits and fabrication